Thermally Conductive Encapsulants
Silicone potting materials with thermal conductivity can be used to disipate heat away from a component to a suitable heat sink.
Addition cure silicones will provide deep section cure allowing for complete encapsulation for envronmental protection while maintaing an effective heat path.
| Product |
Mix Ratio |
Feature |
Conductivity |
| QSil553 |
1:1 |
Grey, Moderately low viscosity, UL94 V-0 |
0.68 W/mK |
| QSil573 |
1:1 |
Grey, good conductivity, meets UL94 V-0 |
0.90 W/mK |
| SE2003 |
1:1 |
Pink, good thermal conductivity |
1.27W/mK |
| SE2008T |
1:1 |
Black Low viscosity |
0.50 W/mK |
| AS1421 |
1-Part |
Grey 1-Part heat cured |
2.10 W/mK |
For more information about thermally conductive silicones download the ACC Product application sheet
For more information about thermally conductive silicones in Automotive download the ACC application sheet
Applications:
- Underbonnet electronics
- Sealing sensors
- PV & Solar power
- LED packaging