Self Bonding Silicone Gel
EGel3003 with Chemical Adhesion
All silicone gels have mechanical adhesion (tack) but do not automatically form a chemical bond with the substrate. This new heat cured gel forms a stong chemical bond which will prevent moisture ingress. Electronic potting applications and general encapsulation applications which are subject to harsh environmental condition will benefit from this additional adhesion.
Low viscosity makes mixing easy and cure is complete after 30 minutes @ 120ºC
Technical Specification
| Code |
Colour |
Viscosity |
Temp ºC |
Cure @120ºC |
SG |
| EGel3003 |
Translucent |
550 mPa.s |
-55 to +200 |
30 mins |
0.97 |
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Applications
Please note: EGel3003 is not optically clear and is therefore not recomended for light transmitting applications such as LED and Photovoltaic's
