Click here for a sample
QSil573
| Product Code |
QSil573 |
| Sub Group |
Encapsulant |
| Description |
SILCOTHERM 2-Part Thermally Conductive Encapsulant |
| Feature 1 |
Thermally Conductive 0.90 W/mK |
| Feature 2 |
1:1 Mix ratio |
| Feature 3 |
Good Flow properties |
| Feature 4 |
Meets UL94 V0 standards |
| Pack Type |
2-Part AB |
| Rheology |
Flowable |
| RTV or Heat cure |
Heat Acclerated RTV |
| Cure Type |
Addition |
| Details |
| Colour | Grey |
| Colour A Part | White |
| Colour B Part | Grey |
| CTE Linear ppm/ C | 155 |
| CTE Volumetric ppm/ C | 465 |
| Cure Type | Addition |
| Description | SILCOTHERM 2-Part Thermally Conductive Encapsulant |
| Dielectric Constant | 4.92 |
| Dissipation Factor @1MHz | 0.00539 |
| Duro Shore A | 65 |
| Elongation % | 50 |
| FDA | No |
| Feature 1 | Thermally Conductive 0.90 W/mK |
| Feature 2 | 1:1 Mix ratio |
| Feature 3 | Good Flow properties |
| Feature 4 | Meets UL94 V0 standards |
| Linear Shrinkage % | 0.10 |
| Max Cure Hrs @ 25C | 24 |
| Max Cure Mins @ 100C | 35.00 |
| Max Working Temp +C | 200 |
| Min Working Temp - C | -50 |
| Mix Ratio | 1:1 |
| Non Corrosive | Yes |
| Pack Type | 2-Part AB |
| Pharma Grade | No |
| Pot Life mins | 60 |
| Product Code | QSil573 |
| Rheology | Flowable |
| RTV or Heat cure | Heat Acclerated RTV |
| Self Bonding | No |
| SG | 2.10 |
| SG A Part | 2.10 |
| SG B Part | 2.10 |
| Shelf Life Mths | 6 |
| Sub Group | Encapsulant |
| Tensile MPa | 1.05 |
| Thermal Conductivity W/mK | 1.19 |
| UL 94V-0 | Yes |
| Viscosity A-Part mPas | 6000 |
| Viscosity B-Part mPas | 6000 |
| Viscosity Mixed mPas | 6000 |
| Volume Resistivity ohms cm | 5.06 E+13 |
TDS Download MSDS Download MSDS2 Download Request Sample