Thermal Tansfer Grease Paste
Non-setting silicone grease or compounds are designed to improve thermal transfer at the interface between processor and heat sink. They work by removing insulating air gaps and improving heat dissipation through the use of conductive fillers. Processor performance is thereby optomised and working life extended.
In addition to the obvious use with processors these versatile compounds can be employed wherever there is a need to dissapate heat without forming a permananent bond between the two surfaces.
ACC have two standard materials:
SG500 with Thermal Conductivity of 0.77 W/mK
SG502 with Thermal Conductivity of 3.00 W/mK
Download the ACC Silicones Thermal Transfer Application sheet